Wafer Cutting

We help our customers to optimize their wafer quality and production yield with specialized product lines for different wafer cutting processes.

The Pluriol® brand is well established in the industry as a wafer cutting fluid. This brand is based on polyalkylene glycol chemistry, which provides our customers the flexibility to design tailor-made cutting slurries that match their process requirements.

The Pluriol® portfolio ensures optimized production economics through

• Constant high wafer quality
• High yield, less wafer breakage
• Low power consumption
• Minimized kerf loss
• High recycling efficiency
• Neutral pH, non-corrosive
• Sufficient thermal conductivity

Our world class production technology guarantees constant high product quality. BASF’s multi-purpose production sites, organized around our Verbund concept, provide flexibility and reliability of supply.

Additionally, BASF offers a wide range of additives for further advanced properties

• Pluronic® for enhanced lubricant properties
• Plurafac® for enhanced wetting properties of grain sizes
• Korantin® to prevent corrosion
• Sokalan® to improve dispersion and suspension properties
• Protectol® as biocidal active ingredients
• Tetronic® as scale inhibitor